ViaMat Nonwoven Aramid Paper Improves Dimensional Stability
   May  20th,  2009
EAST WALPOLE, MASS. � March 31, 2009 � Hollingsworth & Vose today introduced its ViaMat™ aramid paper as a new nonwoven organic reinforcement material for electronic packaging. The new ViaMat paper delivers improvements in dimensional stability and enables higher interconnect densities.